[1] G. Dou, A. S. Holmes, System Integration for Plastic Electronics Using Room Temperature Ultrasonic Welding, Advanced Engineering Materials, 2020, p.101002
[2] X. Song, Q. Wang, H. Liu, G. Dou, et al., A method for alleviating the effect of pinhole defects in inter-metal dielectric films, J. Micromech. Microeng. Vol.29, 2019, p.015012
[3] H. Liu, W. T. Pike, G. Dou, A seesaw-lever force-balancing suspension design for space and terrestrial gravity-gradient sensing, Journal of Applied Physics, Vol.119, 2016, p.124508
[4] G. Dou, A. S. Holmes, et al, Transfer of Functional Ceramic Thin Films Using a Thermal Release Process, Advanced Materials, Vol.23 (10), 2011, pp.1252-125
[5] G. Dou, D. C. Whalley, C. Liu, Mechanical Characterization of Individual Ni/Au Coated Microsize Polymer Particles, Applied Physics Letters, Vol.12, 2008, pp.104018
[6] B. Li, C. Wang, G. Dou, Synthesis of Multiferroic Bi0.9La0.1Fe0.95Mn0.05O3/ Ba0.7Sr0.3TiO3/Ni0.8Zn0.2Fe2O4 Nanotubes with One Closed End Using a Template-assisted Sol–gel Process, CrystEngComm, Vol.15(11), 2013, p.2147-2156、
[7] B. L, C. Wang, G. Dou, et al., Effects of Ba0.7Sr0.3TiO3-based buffer layers and La/Mn doping on the crystallization behavior and multiferroic properties of Bi, RSC Advances, Vol.4(99), 2014, p.101039
[8] W. Liu, C. Wang and G. Dou, et al., Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface, Applied Physics Express, Vol.10 (1), 2017, p.017202
[9] G. Dou, Y. C. Chan, et al., Electrical Conduction Characteristics of Anisotropic Conductive Adhesive Particles, ASME, Journal of Electronic Packaging, Vol.125(4), 2003, pp.609-616
[10] G. Dou, D. C. Whalley, C. Liu, An Experimental Methodology for the Study of Co- planarity Variation Effects in Anisotropic Conductive Adhesive Assemblies, Soldering & Surface Mount Technology, Vol.22(1), 2010, pp.47-55
